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  1. Semiconductor Equipment Corporation - Semicorp.com

    SEC manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the ...
    handling2
    BGA1
    Semiconductor Equipment1
    pick and place1
    microelectronic1
    flip chip1
    silicon wafer1
    assembly equipment1
    die bonder1
    multichip modules1
    uv tape1
    surface mount rework1
    blue tape1
    epoxy dispenser1
    temporary adhesives1
    water soluble adhesives1
    semiautomatic assembly1
    wafer dicing tape1
    backlap tape applicator0
    die expander0
    eutectic die bonder0
    multifunctional bond tester0
    semicorp.com0
    wafer fracturer0

    www.semicorp.com - 2009-02-04

  2. Syagrus Systems LLC - Automated Wafer Backgrind, Automated Wafer Dicing, Automated and Manual Die Visual Inspection, Automated and Manual Die Sort

    Syagrus Systems LLC provides wafer grinding, dicing, inspection, and packaging services to the semiconductor insdustry
    packaging3
    silicon wafer1
    dicing1
    wafer processing1
    carrier tape1
    wafer handling1
    wafer dicing1
    wafer slicing1
    wafer fab1
    wafer fabrication1
    wafer bumping1
    semiconductor wafer1
    dry packaging1
    wafer probe1
    wafer prober1
    wafer test1
    die sort1
    wafer cutting1
    wafer backgrinding1
    thin wafer1
    semiconductor wafer processing1
    wafer sawing1
    wafer dicing tape1
    bare die processing0
    bumped die processing0
    bumped wafer processing0
    bump wafer inspection0
    component bake0
    dicing technology0
    die visual inspection0
    polishing single wafer0

    www.syagrussystems.com - 2009-02-08

particle wafers1 silicon wafer1 packaging3 quartz2 silicon2 wafer bumping1 wafer cutting1 wafer slicing1 flip chip1 wire slicing1 prime wafers1 solder1

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